Printing technology enables continuous, high-speed fabrication of thermoelectric devices on both flexible and rigid substrates. The printing process, patterns, substrates and inks need to be investigated and optimized for the fabrication of these printable thermoelectric devices. Ink design in terms of physical properties like wettability and viscosity, choice of binder and filler materials is a critical part in the fabrication of printable thermoelectric devices, especially printable p-type materials and n-type materials to make p-n junctions. In this study, we described the mechanism of thermoelectric generator and synthetic method of thermoelectric materials for printing inks. And the BiTe/ epoxy resin and BiTe/ polystyrene printing inks were prepared with high energy ball milled BiTepowder.
|Revista||Tetsu-To-Hagane/Journal of the Iron and Steel Institute of Japan|
|Estado da publicação||Published - 2009|